AMD says Pensando DPUs underpin Oracle Acceleron SmartNICs to offload networking, storage and security for AI and cloud workloads. The blog post also emphasized programmability. AMD said Pensando DPU technology gives OCI a foundation for evolving networking, storage, security and…
The distinction matters because faster engineering assistance and faster delivery of a working processor are different claims. A model can help complete individual assignments without establishing an advantage across an entire hardware program. Nvidia also has published research on AI-assisted…
digitimes Anthropic's Claude reportedly cuts custom chip design timelines with a 15-person team Keep me signed in - Track financials & stock data of Taiwan tech. - GlobalFoundries wins US$2 billion TSMC interposer deal, closing a US packaging gap - TSMC breaks silence on…
Oracle Cloud Infrastructure will add Google Tensor Processing Units (TPUs) to its AI compute portfolio, making OCI the first hyperscale cloud provider outside Google to offer Google TPUs. The move gives OCI customers another accelerator option for AI training and…
Oracle and Google told customers on 27 October 2026 that Google TPUs on OCI will arrive in 2027, and Oracle plans to become the first hyperscale platform outside Google to host the chips. The timing is the catch. Nothing is on sale today,…
Anthropic (NASDAQ:ANT) is highlighting its in-house chip design capabilities to prospective initial public offering investors, framing artificial intelligence-assisted semiconductor engineering as an operational edge ahead of a planned public debut that could value the company near $1.5 trillion, according to…
marketscreener.com Published on 11/03/2026 at 10:08 am EST Latest news about NVIDIA Corporation Income Statement and Estimates NScale, Anthropic in Talks for $45B AI Computing Deal October 20, 2026 at 01:54 pm EDT
The impact of the artificial intelligence boom is no longer limited to graphics cards or memory. It has now affected another basic component: printed circuit boards (PCBs). The huge demand for hardware used in AI data centers is taking up…
In-memory computing platform Hazelcast announced this week that it has closed a $21.5 million funding round. UK-based investor C5 Capital led the round, with participation from existing investors Bain Capital Ventures, Earlybird Venture Capital and Capital One Growth Ventures. This latest round…
ASMPT's advanced packaging unit posted record first-half revenue of $339 million, with thermo-compression bonding sales up 146%, while its semiconductor solutions segment fell short of analyst estimates in the same quarter. ASMPT's revenue jumped 49% in the third quarter on AI chip demand,…
Chips designed by AI's biggest buyers, Google TPUs, Amazon Trainium, Microsoft Maia and Meta MTIA, and the designers Broadcom and Marvell.
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